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Rohde & Schwarz

Advanced Probing In DDR3/DDR4 Memory Designs

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For reliable and efficient system verification and debug of DDR3/DDR4 memory designs, comprehensive compliance test and analysis tools are required. While measurement capability and usability are critical to speed up the verification and debug process, it is equally important to choose the right probing solution and use...

Published: May 19, 2022
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Rohde & Schwarz

System Level Verification and Debug of DDR3/4 Memory Designs

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This application note provides an introduction to the DDR memory technology and explains common challenges, related to the specific nature of DDR data, command / address and control buses and describes the typical measurements to verify and debug DDR system designs. The paper explains the recommended test points and...

Published: May 19, 2022
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Allegro MicroSystems

Innovative FOC Motor Control: Improve Time To Market By Eliminating Software Development

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In recent years, brushless DC [BLDC] motor control has been gaining traction in markets where improvements in battery life are required, such as cordless power tools. This is largely being driven by demand for increased efficiency, lower noise, and higher reliability. Just a short time ago, BLDC motors used in high performance...

Published: Mar 10, 2022
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NI

Engineer’s Guide to 5G Semiconductor Test

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This paper assumes a basic familiarity with the 5G physical layer; it focuses on the new challenges of testing semiconductor devices for wideband 5G applications. The enhanced mobile broadband (eMBB) use case points to supporting greater user data rates and increased system capacity. Departing from legacy 3G and 4G cellular...

Published: Apr 27, 2021
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Renesas Electronics Europe

RS-485 Transceiver Tutorial

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This in-depth white paper guides you through the choices and weighs key design considerations to help you pick the right transceiver. It reviews the most typical RS-485 ICs and explore the most common design considerations. Then it examines electrostatic discharge (ESD) protection and compare the Human Body Model (HBM)...

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NI

5G mmWave Semiconductor Device Test

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To achieve some of the ambitious Key Performance Indicators of 5G enhanced Mobile Broadband, semiconductor devices for 5G infrastructure need to empower reliable multi-user MIMO (MU-MIMO) functionality at mmWave frequencies with larger channel bandwidths. 5G base stations achieve this spatial multiplexing by employing...

Published: Feb 24, 2021
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NXP Semiconductors Netherlands B.V.

NXP’s Mini Logic portfolio

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When first introduced, logic product offerings consisted of quad, hex and octal standard logic gates, inverters and buffers. As integration and miniaturization occurred, the demand for logic solutions continued to grow, but shifted toward “control” or “glue” logic.  Control logic...

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Lattice Semiconductor Corporation

Solving Today’s Interface Challenges With Ultra-LowDensity FPGA Bridging Solutions

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Designers are implementing a wide variety of interface bridging solutions that allow them to transfer data across protocols and, in the process, expand system functionality. The challenge is determining how to most efficiently implement these new bridging solutions without violating system power, footprint and cost requirements....

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Texas Instruments

Accurately measuring efficiency of ultralow-IQ devices

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While almost every power-supply engineer intimately knows and understands the lab setup for measuring efficiency, there are many important nuances that must be considered when measuring the efficiency of a device with ultralow quiescent current (IQ). For a device that consumes less than 1 µA, the circuit’s...

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Lattice Semiconductor Corporation

MachXO™: Optimized Programmable Devices for Bus Interfaces, Bridges and Control

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Bus bridging, interfacing and control are common functions in many electronic systems. The use of these functions spans virtually every end market segment, including automotive, consumer, communications, computing, industrial and military. In many cases, designers turn to programmable logic devices, either low-capacity...

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Renesas Electronics Europe

Communication Module Requirements for IoT Applications

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With the rapid spread of the IoT, many devices that were not connected to a network in the past increasingly require the integration of a communication module function. Conversely, the number and severity of security threats are also on the rise. Microcontrollers therefore must meet a range of demands, including smaller...

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Vicor Corporation

VIA PFM from Vicor Enables Power Component Design Methodology from AC to the Point of Load

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This White Paper describes how the new VIA PFM, a power component that performs the front-end AC-DC conversion required in many systems, allows the application of Vicor’s Power Component Design Methodology from AC to the Point of Load (PoL). The performance of the component is described, highlighting how the VIA...

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Integrated Silicon Solution (ISSI)

How to Choose the Right DRAM for an Application

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While price and density play large roles in selecting dynamic random access memory (DRAM), many other considerations must be taken into account. For example, long-term product support is a key consideration for many applications. Manufacturers of products with long product lifecycles, such as network infrastructure...

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Renesas Electronics Europe

The Need for Security

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With the recent rise of the Internet of Things (IoT), 14 billion devices are now connected. However, the growth of this is also significant, by 2020 it is predicted that over 50 billion devices will be connected. With these devices connected, systems are opened up for remote access and control. In turn, this has shown...

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