Harwin
flow-image

Maximizing Power in High-Reliability Applications: Applying SWaP to Connectivity

Published by Harwin

The Harwin whitepaper "Maximizing Power in High-Reliability Applications: Applying SWaP to Connectivity" focuses on optimizing Size, Weight, and Power (SWaP) in electronic components for high-reliability applications. It highlights key considerations in connector selection, including size, weight, power density, and material choice, relevant to markets like aerospace, defense, and UAVs. The document presents real-world applications and showcases Harwin’s product lines, such as Gecko-MT, M300, and Kona series, which are designed to meet the stringent requirements of the electronic pro market.

Download Now

box-icon-download

Required fields*

Please agree to the conditions

By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@headleymedia.com .

Related Categories Power, Connectors, Connectors, PCB

More resources from Harwin