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ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS

Published by Boyd

This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced bubble ejection process in which small vapor bubbles attached to a solid surface are dislodged and propelled into the cooler bulk liquid. This ejection technique involves forcibly removing the attached vapor bubbles with a submerged pressure difference generated by a vibrating piezoelectric diaphragm operating at ultrasonic frequencies. 

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Related Categories Components, Embedded, Power, Actuators, Processors, cooling