Computer-on-Module: selecting the right form factor and processor

This resource is published by Advantech


When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the right form factor and processor for the application can be a challenging task for design engineers.

COM solutions provide a cost-effective computer building block: a COM is a development board featuring a computer processor, chipset, cooler, heat sink, memory, ECC memory, secure boot, and peripherals – all designed into a single module. By specifying COMs, designers negate the necessity of building their own CPU core design, with all the time and cost that activity consumes. Instead, adopting the modular COM strategy provides a more cost-effective and shorter time to market, while simultaneously making it easy to scale or upgrade in the future.

Download this guide to learn how design engineers can optimise their COM solution choices. 


Related categories
Embedded, Power, Industrial, Communication, Edge computing, Displays, Processors


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